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Ultra-precision polishing - メーカー・企業と製品の一覧

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[Polishing Technology] Ultra-Precision Wrapping Processing / Ultra-Precision Polishing Processing

From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.

Our company specializes in "ultra-precision lapping processing/ultra-precision polishing processing." "Ultra-precision lapping processing" involves performing sliding motion (fitting) while containing free abrasive particles (grinding agents), which polishes the workpiece by micro-cutting, resulting in a flatter finish. "Ultra-precision polishing processing" is a polishing method that finishes the lapped surface to a flat mirror finish. For hard materials, hard polishing processing using diamond powder is employed, while mechanochemical polishing is used for oxides and magnetic materials. 【Features of Ultra-Precision Lapping Processing】 - Free abrasive processing that results in a flatter finish for the workpiece - Achieves high-precision processing surfaces and dimensions - Compatible with a wide range of materials, from ceramics to metals, glass, and single crystals - A processing method has also been developed that uses diamond abrasives fixed to a metal flat plate to generate high-precision surfaces. *For more details, please refer to the PDF document or feel free to contact us.

  • Ceramics
  • Other metal materials
  • Wafer processing/polishing equipment

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Polishing Technology: Ultra-Precision Polishing Processing

It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.

Polishing processing is a grinding method that finishes a wrapped surface of pear skin into a flat mirror surface. Compared to wrapping processing, the application of pressure during processing remains the same, but the processing liquid and media are completely different. For polishing processing of hard materials, hard polishing using diamond powder is employed, while for oxides and magnetic materials, mechanochemical polishing is used. The surface roughness can achieve levels from sub-micron to nanometers. Additionally, there are both double-sided and single-sided processing machines, and when high precision such as TTV and LTV is required, double-sided machines are used.

  • Ceramics
  • Other metal materials
  • Wafer processing/polishing equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録